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Technology
What level are you on?
Are you fabricating today's toughest Interconnects?
Then, we have test solutions for you.
for C4, MCM, BGAs ...
Nidec-Read is
where you can find solutions to your semiconductor substrate
interconnect test needs. When your current test systems cannot
deliver the performance needed
for today's advanced technology applications, Nidec-Read delivers.
Bare Board Test Technology available from Nidec-Read
includes:
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Electrical
Test Options |
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Step & Repeat |
- multiple image panel test
- accurate enough to test the finest
pitch devices
- very high throughput
... increase yields
.... decrease fixture
costs |
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CCD Camera Alignment |
- a key element for successful electrical
test at your level
- CCD cameras measure your fiducials and
provide control of test pin placement
- 4-way search
... reduce test time
... quick, simple changeovers
... increase yields
... increase technology capability |
| New - Buckling Beam Fixtures |
New Buckling Beam fixtures dramatically
advance electrical test ability to directly contact very small pads. This new fixture style features:
- ability to test very small pitch
products
- highly reliable pins
- can be maintained by operator or
maintenance level personnel
- direct contact with test pad
- low force contact - extremely low "witness"
marking
Buckling Beam Pin
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TRL
Non-Contact Test |
- for extremely fine pitch applications
- no pin marks on sensitive pads
- robust design with very long life
- provides added immunity to dust and debris
... increase technology capability
... enhance competitive position |
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 Sister -
"short-in-short" Test
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- in the presence of a
plating bar, "Sister" can identify unwanted
shorts.
... lower costs |
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TDR |
- measure net lengths less than 1/2"
with Industry Standard
technique
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